Services Overview
Design Support
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Prototype Assembly
Printed Circuit Board Assembly
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PCB Assembly

At Mack Technologies, we continually optimize our manufacturing environment to take full advantage of the latest assembly and test equipment available. Our equipment strategy is designed to produce a highly flexible manufacturing environment that meets the changing needs of our customers. It includes identically configured, multiple top and bottom-side lines, as well as equipment feeders for offline setups. Our robust board assembly operations can accommodate a variety of highly complex technology requirements.

All of our facilities employ common manufacturing and test platforms and a common manufacturing quality system. This allows a rapid transition of manufacturing operations  - either as part of a cost migration strategy or for a dual site qualification plan to address disaster recovery risks. The use of our powerful real time shop floor quality tracking systems enables our engineering teams to quickly address any issues that arise – thereby strengthening production quality and minimizing operational costs.

Sample Technologies and Capabilities:

  • Board sizes up to 20” x 24”
  • PBGA, CBGA, TBGA, CGA
  • Micro BGA (.5mm)
  • 0402’s, 0204’s, 0201’s
  • VHDM Press Fit Connectors
  • SMT Connectors and other odd shaped components
  • Flex Circuits
  • Conformal coating
  • Vacuum bonding
  • RoHS compliant production
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