Circuit Board Assembly

Mack Technologies continually optimizes our manufacturing environment to take full advantage of the latest circuit board assembly (PCBA) equipment and inspection technology available.  Our mature processes support a highly flexible manufacturing environment that meets the evolving needs of our customers.  Our identically configured assembly operations focus on accommodating a variety of highly complex technology requirements in a low to medium volume environment.

All of our facilities employ common manufacturing, inspection, and test platforms integrated with a common manufacturing quality system. This allows a rapid transition of manufacturing operations; either as part of a cost migration strategy or for a dual site qualification plan to address disaster recovery risks. The use of our powerful real time shop floor quality tracking systems enables our engineering teams to quickly address any issues that arise, strengthening production quality and minimizing operational costs.

Manufacturing
  • Flex, rigid flex, and rigid PCB form factors
  • SMT, through-hole, and mixed technology
  • Board sizes up to 20” x 24”
  • Complex, high density assemblies
  • PBGA, CBGA, TBGA, FPGA, CGA, LGA
  • Package on Package (PoP) assembly
  • Micro BGA (0.4mm)
  • 0402s, 0201s, 01005s
  • Wave and selective solder
  • Backplane and press-fit assembly
  • Automated conformal coating / potting
  • Automated under-fill

Inspection
  • Koh Young 100% in-line 3D solder paste inspection (SPI)
  • In-line 2D Automated Optical Inspection (AOI)
  • Koh Young 3D Automated Optical Inspection (AOI)
  • Dage 2D X-ray
  • Agilent 5DX
  • Component traceability to reference designators

For more information about how Mack can support your circuit board assembly requirements, please contact us.